SIMULATION ANALYSIS AND PHYSICAL TEST

The designed TL-shaped DMS method to reduce crosstalk is simulated for multiple times, verified, and optimized on HFSS software. A three-layer PCB board model with length x =80 mm and width y =20 mm is designed in this paper, at the same time, no solder mask coating is added to explore the actual situation of crosstalk between microstrip lines. In order to ensure that the characteristic impedance of the microstrip line is 50 Ω, the specific parameters of the microstrip line are designed as follows: microstrip line width s =1.2 mm, microstrip line height m =0.06 mm, microstrip line spacingw =1 mm, the material of the dielectric layer is widely used FR4 material, the dielectric constant is set to 4.4, the thickness of the dielectric layer is h =0.8 mm, and the reference strata thickness is n =0.2 mm. To compare DMS designs with the best crosstalk suppression capabilities, a three-layer PCB model using a common coupled microstrip line is set as the control group. The TL-shaped DMS is composed of T-shaped and L-shaped structures, as shown in Figure 6. The design parameters of the TL-shaped DMS through simulation optimization are as follows: a =0.4 mm,b =4.1 mm, c =0.4 mm, d =0.8 mm, e =0.2 mm,f =0.1 mm, g =6.7 mm, p =0.1 mm, k =0.8 mm.