SIMULATION ANALYSIS AND PHYSICAL
TEST
The designed TL-shaped DMS method to reduce crosstalk is simulated for
multiple times, verified, and optimized on HFSS software. A three-layer
PCB board model with length x =80 mm and width y =20 mm is
designed in this paper, at the same time, no solder mask coating is
added to explore the actual situation of crosstalk between microstrip
lines. In order to ensure that the characteristic impedance of the
microstrip line is 50 Ω, the specific parameters of the microstrip line
are designed as follows: microstrip line width s =1.2 mm,
microstrip line height m =0.06 mm, microstrip line spacingw =1 mm, the material of the dielectric layer is widely used FR4
material, the dielectric constant is set to 4.4, the thickness of the
dielectric layer is h =0.8 mm, and the reference strata thickness
is n =0.2 mm. To compare DMS designs with the best crosstalk
suppression capabilities, a three-layer PCB model using a common coupled
microstrip line is set as the control group. The TL-shaped DMS is
composed of T-shaped and L-shaped structures, as shown in Figure 6. The
design parameters of the TL-shaped DMS through simulation optimization
are as follows: a =0.4 mm,b =4.1 mm, c =0.4 mm, d =0.8 mm, e =0.2 mm,f =0.1 mm, g =6.7 mm, p =0.1 mm, k =0.8 mm.