[1] S. Hosseinizadeh, F. Tan and S. Moosania, ”Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins,” Applied Thermal Engineering, vol. 31, no. 17-18, pp. 3827-3838, 2011. [2] T. N. Porto, J. M. P. Q. Delgado, A. S. Guimarães, H. L. F. Magalhãs, G. Moreira and B. B. Correia, ”Phase Change Material Melting Process in a Thermal Energy Storage System for Applications in Buildings,” Energies, vol. 12, no. 13, p. 3254, 2020.  [3] R. D. Bari, R. Horn, B. Nienborg, F. Klinker, E. Kieseritzky and a. Pawelz, ”The environmental potential of phase change materials in building applications. A multiple case investigation based on life cycle assessment and building simulation,”Energies, vol. 12, no. 13, p. 3045, 2020.  [4] B. Zalba, J. M. Marı́n, L. F. Cabeza and H. Mehling, ”Review on thermal energy storage with phase change: materials, heat transfer analysis and applications,”Applied Thermal Engineering, vol. 23, no. 3, p. 2003, 2003. [5] F. Agyenim, N. Hewitt, P. Eames and M. Smyth, ”A review of materials, heat transfer and phase change problem formulation for latent heat thermal energy storage systems (LHTESS),” Renewable and Sustainable Energy Reviews, vol. 14, no. 2, pp. 615-628, 2010. [6] D. Pal, Joshi and Y. K, ”Melting in a side heated tall enclosure by a uniformly dissipating heat source,” International Journal of Heat and Mass Transfer, vol. 44, no. 2, pp. 375-387, 1999.[7] S. A. Isaacs, Y. J. Kim, A. J. McNamara, Y. Joshi, Y. Zhang and M. S. Bakir, ”wo-phase flow and heat transfer in pin-fin enhanced micro-gaps,”13th IEEE ITHERM Conference, vol. 978, pp. 1084-1089,, 2012. [8] R. Baby and C. Balaji, ”Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling,” International Journal of Heat and Mass Transfer, vol. 55, no. 5-6, pp. 1642-1649, 2012. [9] R. Pakrouh, M. J. Hosseini and a. A. A. Ranjbar, ”A parametric investigation of a PCM-based pin fin heat sink,” Mechanical Sciences, vol. 6, no. 1, p. 65–73, 2015. [10] H. Ali, A. Arshad, M. Jabbal and P. Verdin, ”Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison,” International Journal of Heat and Mass Transfer, vol. 117 , pp. 1199-1204, 2018. [11] R. Kandasamy, X. Wang and A. S. Mujumdar, ”Transient cooling of electronics using phase change material (PCM)-based heat sinks,” Applied Thermal Engineering, vol. 28, no. 8–9, pp. 1047-1057, 2008. [12] M. Jaworski, ”Thermal performance of heat spreader for electronics cooling with incorporated phase change material,” Applied Thermal Engineering, vol. 35, pp. 212-219, 2012. [13] A. Arshad, H. M. Ali, M. Ali and S. Manzoor, ”Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction,” Applied Thermal Engineering, vol. 112, pp. 143-155, 2017. [14] I. A. Siyabi, S. Khanna, T. Mallick and S. Sundaram, ”Multiple Phase Change Material (PCM) Configuration for PCM-Based Heat Sinks—An Experimental Study,” Energies, vol. 11, no. 7, p. 1629, 2018.  [15] M. J. Ashraf, H. M. Ali, H. Usman and A. Arshad, ”Experimental passive electronics cooling: Parametric investigation of pin-fin geometries and efficient phase change materials,” International Journal of Heat and Mass Transfer, vol. 115, pp. 251-263, 2017. [16] J. Liu, S. Y. S. Yang, Y. Zhang, X. Fan and B. Gao, ”Numerical Studies on the Performance of the PCM Mesh-Finned Heat Sink Base on Thermal-Flow Multiphysics Coupling Simulation,”Energies, vol. 13(18), p. 4658, 2020.