loading page

Transient analysis of growth/decay in materials utilizing a digital exponential peeling method
  • +3
  • Jayjit Mukherjee,
  • Amit Malik,
  • Seema Vinayak,
  • Vikram Kumar,
  • D. S. Rawal,
  • R. S. Dhaka
Jayjit Mukherjee
Indian Institute of Technology Delhi

Corresponding Author:[email protected]

Author Profile
Amit Malik
DRDO Solid State Physics Laboratory
Author Profile
Seema Vinayak
DRDO Solid State Physics Laboratory
Author Profile
Vikram Kumar
Indian Institute of Technology Delhi
Author Profile
D. S. Rawal
DRDO Solid State Physics Laboratory
Author Profile
R. S. Dhaka
Indian Institute of Technology Delhi
Author Profile

Abstract

An algorithm is proposed to implement digital peeling to determine dominant time constants of an exponential transient process. The method is simpler to implement and reduces computational time to a large extent in comparison to other techniques widely used. Apart from a synthetic test function, the algorithm has been implemented on reported experimental transient decay curves of Cs 2HfCl 6 (CHC) single crystal scintillation to verify its efficacy. Finally, drain current detrapping transients of unpassivated AlGaN/GaN high electron mobility transistors (HEMTs) are analysed to determine the trap energy levels and concentrations. The validation of this digital peeling technique is also carried out by comparing with conventional method of time constant extraction from HEMT current transients. The extracted exponentials from the transient data efficiently fits well with the experimental data and can be extensively used for transient analysis. The digital peeling technique has wide applicability and can be used to analyze all exponential processes which occur in all domains of science.
29 Aug 2023Submitted to International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
29 Aug 2023Submission Checks Completed
29 Aug 2023Assigned to Editor
29 Aug 2023Review(s) Completed, Editorial Evaluation Pending
04 Sep 2023Reviewer(s) Assigned
07 Mar 20241st Revision Received
09 Mar 2024Review(s) Completed, Editorial Evaluation Pending