The next-generation Industrial and Tactile Internet of Things (IoT) will support smart Cyber-Physical Systems and Industry 4.0, including Smart Cities, and Industrial Automation. It will also support bandwidth-intensive applications, ie Data-Centers, Cloud Computing and the Metaverse. This paper explores ultra-high reliability and throughput in a “Software-Defined Deterministic Internet of Things”. Multiple “Software-Defined Deterministic Wide Area Networks” (SDD-WANs) are introduced into layer 3, using simple “Deterministic Packet Switches” (D-switches). All complex functions are removed from layer-3 hardware, and are migrated into the SDN control-plane. The resulting D-switches can be fabricated on a single \emph{Integrated Circuit}, ie FPGA. To maximize reliability, mission-critical data is routed over multiple paths. A simple Forward Error Correcting (FEC) code transmits coded data over additional paths, to tolerate edge failures. This architecture offers many benefits: (a) “Ultra-High Reliability” is achieved, while reducing bandwidth costs; (b) “Ultra-High Throughput” is achieved, to support Data- Centers, Cloud Computing and the Metaverse; (c) The “bare-metal” D-switches use FPGAs to dramatically lower costs, with potential cost-savings reaching $1-2 Trillion (USD) over 2025…2030. (d) The lower costs address the IEEE’s “Digital Divide”, and can potentially improve Internet access for much of the world. (e) The Software-Defined-Networking (SDN) control-plane integrates Post-Quantum-Cryptography (PQC) and Artificial Intelligence (AI), and achieves ultra-secure Quantum-Safe communications, where each nation can achieve unprecedented protection of its critical infrastructure from external cyber-attackers.