Unstructured
Direct Ink Write 3D Printing of Functional Structures with Ambient
Temperature Curing Dual-Network Thermoset Ink
- Connor D. Armstrong
, - Liang Yue,
- Frédéric Demoly,
- Kun Zhou,
- H. Jerry Qi
![](https://d197for5662m48.cloudfront.net/assets/icons/omniauth/orcid-ca37582cd91a671ed5cec57770e0e96c01b4b79b8b5b75d8598fc1ddac18c974.svg)
03 Aug 2022Submitted to AISY Interactive Papers 09 Aug 2022Published in AISY Interactive Papers