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Feng Li
Public Documents
3
November 29, 2023
Flip Chip Bonding for SiC Integrated Circuits with Gold Stud Bumps for High Temperatu...
Feng Li
July 07, 2022
3D Stacking of SiC Integrated Circuit Chips with Gold Wire Bonded Interconnects for L...
Feng Li
September 29, 2022
Simulation of Different Structured Gate-All-Around FETs at 3 nm Node for Low-Power In...
Nathan Totorica , Wei Hu , Feng Li , et al.
